Edge grip chuck
This is a transport chuck for wafers that have been processed on the back side and are not to be contacted.
Since the wafer can be centered during transport, it is suitable for transporting to stages such as drop-in stages. The front and rear directions of the wafer are guided and held by an air cylinder. The wafer is held by clamping the outer circumference without contacting the back surface. By clamping the outer circumference, centering of the wafer is possible. High-speed transport is achievable. The presence or absence of the wafer can be confirmed by the amount of movement of the guide.
- Company：ジェーイーエル
- Price：Other
